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NXP Launches Unique Dual Magnetic Sensor for Safety-Critical Car Engine Throttle Applications

07:11 EDT Tuesday, June 26, 2012

EINDHOVEN, THE NETHERLANDS--(Marketwire - June 26, 2012) - </b>NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the KMA220, a dual magnetic sensor designed for all automotive applications where a mechanical angle needs to be measured. Integrating two sensor systems in a single package, it is particularly relevant for throttle control applications where a redundant system solution is required. Operating in a simple disk magnet configuration with no need for a PCB or external components, the KMA220 offers a unique solution to the automotive market.

The KMA220 is fully calibrated and ready to use, and incorporates three capacitors in addition to two sensors dies and two signal conditioning ASICs. This, combined with its dual nature, reduces system cost for customers and simplifies the assembly process. To achieve redundancy in throttle applications, car manufacturers have previously had to install two single sensors on a leadframe or onto a PCB, bending them to fit -- typically requiring an expensive ring magnet configuration to operate. With the dual KMA220 sensor, only one simple installation is required.

The KMA220 uses NXP's unique ABCD9 technology, an automotive platform at the cutting edge of analog mixed-signal integration. This technology is based on NXP's CMOS 14 process and significantly improves performance compared to previous sensor products with integrated ASICs. The KMA220 is also qualified according to the new HMM (Human Metal Model) with excellent electrostatic discharge (ESD) protection and EMC performance.

"Building on the success of the KMA210, the KMA220 is a new addition to our existing family of position sensors for the automotive industry and offers customers a package that they can't get anywhere else," explains Stephan zur Verth, vice president and general manager sensor business, NXP Semiconductors. "As a next step, we plan to release a single sensor product in the same package which means that our customers will be able to use the same assembly process for all applications, making it easy for them to choose and install the right solution for their products."

NXP's automotive sensor family is exceptionally robust, capable of operating at temperatures of up to 160 degrees C, compared to the industry average of 150. This is vital for use in EGR (exhaust gas recirculation) applications, where every degree counts.

Availability and Pricing

</b>The KMX220 is available immediately. Indicative pricing is as follows:

- $3.30 US in quantities of 10k pieces

- $2.60 US in quantities of 100k pieces

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Links</b>

- KMA220 Dual Magnetic Sensor (data sheet): http://www.nxp.com/products/sensors/angular_sensors/KMA220.html

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About NXP Semiconductors

</b>NXP Semiconductors N.V. (NASDAQ: NXPI) provides High Performance Mixed Signal and Standard Product solutions that leverage its leading RF, Analog, Power Management, Interface, Security and Digital Processing expertise. These innovations are used in a wide range of automotive, identification, wireless infrastructure, lighting, industrial, mobile, consumer and computing applications. A global semiconductor company with operations in more than 25 countries, NXP posted revenue of $4.2 billion in 2011. Additional information can be found by visiting www.nxp.com.

Forward-looking Statements

</b>This document includes forward-looking statements which include statements regarding NXP's business strategy, financial condition, results of operations, and market data, as well as any other statements which are not historical facts. By their nature, forward-looking statements are subject to numerous factors, risks and uncertainties that could cause actual outcomes and results to be materially different from those projected. These factors, risks and uncertainties include the following: market demand and semiconductor industry conditions; the ability to successfully introduce new technologies and products; the end-market demand for the goods into which NXP's products are incorporated; the ability to generate sufficient cash, raise sufficient capital or refinance corporate debt at or before maturity; the ability to meet the combination of corporate debt service, research and development and capital investment requirements; the ability to accurately estimate demand and match manufacturing production capacity accordingly or obtain supplies from third-party producers; the access to production capacity from third-party outsourcing partners; any events that might affect third-party business partners or NXP's relationship with them; the ability to secure adequate and timely supply of equipment and materials from suppliers; the ability to avoid operational problems and product defects and, if such issues were to arise, to correct them quickly; the ability to form strategic partnerships and joint ventures and to successfully cooperate with alliance partners; the ability to win competitive bid selection processes to develop products for use in customers' equipment and products; the ability to successfully establish a brand identity; the ability to successfully hire and retain key management and senior product architects; and, the ability to maintain good relationships with our suppliers. In addition, this document contains information concerning the semiconductor industry and NXP's business segments generally, which is forward-looking in nature and is based on a variety of assumptions regarding the ways in which the semiconductor industry, NXP's market segments and product areas may develop. NXP has based these assumptions on information currently available, if any one or more of these assumptions turn out to be incorrect, actual market results may differ from those predicted. While NXP does not know what impact any such differences may have on its business, if there are such differences, its future results of operations and its financial condition could be materially adversely affected. Readers are cautioned not to place undue reliance on these forward-looking statements, which speak to results only as of the date the statements were made. Except for any ongoing obligation to disclose material information as required by the United States federal securities laws, NXP does not have any intention or obligation to publicly update or revise any forward-looking statements after we distribute this document, whether to reflect any future events or circumstances or otherwise. For a discussion of potential risks and uncertainties, please refer to the risk factors listed in our SEC filings. Copies of our SEC filings are available from on our Investor Relations website, www.nxp.com/investor or from the SEC website, www.sec.gov.

FOR FURTHER INFORMATION PLEASE CONTACT:

Birgit Ahlborn
Europe:
Tel: +49 170 5746124
Birgit.Ahlborn@nxp.com
OR
Melissa Chanslor
NA:
+1 415 593 8465
MelissaC@text100.com
OR
Lilian Li
APAC:
Tel: +86 21 22052615
lilian.li@nxp.com
OR
Jannet Chen
Greater China:
Tel: +86 21 22055883
jannet.chen@nxp.com




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